Search results for "static test"

showing 10 items of 15 documents

A Methodology for the Analysis of Memory Response to Radiation through Bitmap Superposition and Slicing

2015

A methodology is proposed for the statistical analysis of memory radiation test data, with the aim of identifying trends in the single-even upset (SEU) distribution. The treated case study is a 65nm SRAM irradiated with neutrons, protons and heavy-ions.

Computer sciencebitmap slicingParallel computingHardware_PERFORMANCEANDRELIABILITYRadiationSlicingUpsetElectronic mailSuperposition principleStatic random-access memoryMemoriesstatic testNuclear Experimentdynamic testta114ta213computer.file_formatSRAMBitmap[SPI.TRON]Engineering Sciences [physics]/ElectronicsMultiple Cell Upset (MCU)MCUSERBitmapradiation testevent accumulationSingle Event Upset (SEU)AlgorithmcomputerSEUTest data
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Soft errors in commercial off-the-shelf static random access memories

2016

International audience; This article reviews state-of-the-art techniques for the evaluation of the effect of radiation on static random access memory (SRAM). We detailed irradiation test techniques and results from irradiation experiments with several types of particles. Two commercial SRAMs, in 90 and 65 nm technology nodes, were considered as case studies. Besides the basic static and dynamic test modes, advanced stimuli for the irradiation tests were introduced, as well as statistical post-processing techniques allowing for deeper analysis of the correlations between bit-flip cross-sections and design/architectural characteristics of the memory device. Further insight is provided on the …

ImaginationDynamic test modeComputer sciencemedia_common.quotation_subject01 natural sciencesParticle detector[SPI]Engineering Sciences [physics]0103 physical sciencesMaterials ChemistryElectronic engineeringStatic random-access memoryElectrical and Electronic EngineeringLayer (object-oriented design)Ionizing Particlesmedia_common010302 applied physics[PHYS]Physics [physics]010308 nuclear & particles physicsDetectorCondensed Matter PhysicsSRAMBit mappingElectronic Optical and Magnetic MaterialsStatic test modeMarch testParticle detectorCommercial off-the-shelfRandom accessDynamic testing
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Heavy-Ion Radiation Impact on a 4 Mb FRAM Under Different Test Modes and Conditions

2016

International audience; The impact of heavy-ions on commercial Ferroelectric Memories (FRAMs) is analyzed. The influence of dynamic and static test modes as well as several stimuli on the error rate of this memory is investigated. Static test results show that the memory is prone to temporary effects occurring in the peripheral circuitry, with a possible effect due to fluence. Dynamic tests results show a high sensitivity of this memory to switching activity of this peripheral circuitry.

ImaginationNuclear and High Energy PhysicsHeavy ion radiationMaterials science130 nmmedia_common.quotation_subject[PHYS.NEXP]Physics [physics]/Nuclear Experiment [nucl-ex]01 natural sciencesFluence[SPI]Engineering Sciences [physics]0103 physical sciencesStatic testingSensitivity (control systems)Electrical and Electronic Engineeringradiation testingSimulationmedia_common010302 applied physicssingle event upset (SEU)ta114ta213010308 nuclear & particles physicsbusiness.industrymultiple cell upset (MCU)FerroelectricityNon-volatile memoryRadiation testingFRAM130nm technologyNuclear Energy and EngineeringOptoelectronicsbusinessstatic and dynamic mode testingIEEE Transactions on Nuclear Science
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Heavy-Ion Radiation Impact on a 4Mb FRAM under Different Test Conditions

2015

The impact of heavy-ions on commercial Ferroelectric Memories (FRAMs) is analyzed. The influence of different test modes (static and dynamic) on this memory is investigated. Static test results show that the memory is prone to temporary effects occurring in the peripheral circuitry. Dynamic tests results show a high sensitivity of this memory to heavy-ions.

Ionizing radiation[PHYS]Physics [physics]010302 applied physicsRandom access memoryMaterials scienceHeavy ion radiationta114ta213010308 nuclear & particles physics01 natural sciencestest conditions[SPI.TRON]Engineering Sciences [physics]/ElectronicsNon-volatile memoryMultiple Cell Upset (MCU)FRAM0103 physical sciencesStatic testingElectronic engineeringSensitivity (control systems)radiation testing130nmSingle Event Upset (SEU)static and dynamic mode testingSimulation
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Damage Identification of Beams Using Static Test Data

2003

A damage identification procedure for beams under static loads is presented. Damage is modelled through a damage distribution function which determines a variation of the beam stiffness with respect to a reference condition. Using the concept of the equivalent superimposed deformation, the equations governing the static problem are recast in a Fredholm’s integral equation of the second kind in terms of bending moments. The solution of this equation is obtained through an iterative procedure as well as in closed form. The latter is explicitly dependent from the damage parameters, thus, it can be conveniently used to set-up a damage identification procedure. Some numerical results are present…

NoiseIdentification (information)Distribution functionDeformation (mechanics)Bending stiffnessMathematical analysisStatic testingBending momentIntegral equationMathematics
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Single-Event Effects in the Peripheral Circuitry of a Commercial Ferroelectric Random Access Memory

2018

International audience; This paper identifies the failure modes of a commercial 130-nm ferroelectric random access memory. The devices were irradiated with heavy-ion and pulsed focused X-ray beams. Various failure modes are observed, which generate characteristic error patterns, affecting isolated bits, words, groups of pages, and sometimes entire regions of the memory array. The underlying mechanisms are discussed.

Nuclear and High Energy PhysicsComputer sciencekäyttömuistit02 engineering and technologysingle-event effect01 natural sciencesMemory arrayElectronic mailX-ray0103 physical sciencesElectronic engineering[SPI.NANO]Engineering Sciences [physics]/Micro and nanotechnologies/MicroelectronicsElectrical and Electronic Engineeringstatic testComputingMilieux_MISCELLANEOUSdynamic testEvent (probability theory)Random access memoryta114ta213010308 nuclear & particles physicsbusiness.industrySEFImuistit (tietotekniikka)021001 nanoscience & nanotechnologyFerroelectricityheavy ionsingle-event upsetNon-volatile memoryFRAMsäteilyfysiikkaNuclear Energy and EngineeringSingle event upsetPhotonics0210 nano-technologybusinessIEEE Transactions on Nuclear Science
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Methodologies for the Statistical Analysis of Memory Response to Radiation

2016

International audience; Methodologies are proposed for in-depth statistical analysis of Single Event Upset data. The motivation for using these methodologies is to obtain precise information on the intrinsic defects and weaknesses of the tested devices, and to gain insight on their failure mechanisms, at no additional cost. The case study is a 65 nm SRAM irradiated with neutrons, protons and heavy ions. This publication is an extended version of a previous study.

Nuclear and High Energy PhysicsEngineeringHardware_PERFORMANCEANDRELIABILITYRadiation[PHYS.NEXP]Physics [physics]/Nuclear Experiment [nucl-ex]01 natural sciencesstatistical analysis0103 physical sciencesStatic testingElectronic engineeringmemory responseStatistical analysisSensitivity (control systems)Static random-access memoryElectrical and Electronic Engineeringstatic testCluster of bit-flipsdynamic test010302 applied physicsSingle event upset SEURandom access memoryta114ta213010308 nuclear & particles physicsbusiness.industrymultiple cell upset (MCU)säteilySRAMReliability engineeringradiationNuclear Energy and EngineeringSingle event upsetradiation effectsbusiness[MATH.MATH-NA]Mathematics [math]/Numerical Analysis [math.NA]Dynamic testing
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Investigation on MCU Clustering Methodologies for Cross-Section Estimation of RAMs

2015

International audience; Various failure scenarios may occur during irradiation testing of SRAMs, which may generate different characteristic Multiple Cell Upset (MCU) error patterns. This work proposes a method based on spatial and temporal criteria to identify them.

Nuclear and High Energy PhysicsEngineeringcomputer.software_genreUpsetCross section (physics)Static testingCluster of bit flipsStatic random-access memoryElectrical and Electronic Engineeringradiation testingstatic testCluster analysisdynamic test[PHYS]Physics [physics]single event upset (SEU)ta213ta114Cross sectionbusiness.industrySEFImultiple cell upset (MCU)SRAM[SPI.TRON]Engineering Sciences [physics]/ElectronicsRAMRadiation testingMicrocontrollerMCUNuclear Energy and EngineeringSEU clusterData miningbusinesscomputerDynamic testing
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The Hu-Washizu variational principle for the identification of imperfections in beams

2008

This paper presents a procedure for the identification of imperfections of structural parameters based on displacement measurements by static tests. The proposed procedure is based on the well-known Hu–Washizu variational principle, suitably modified to account for the response measurements, which is able to provide closed-form solutions to some inverse problems for the identification of structural parameter imperfections in beams. Copyright © 2008 John Wiley & Sons, Ltd.

Numerical AnalysisMathematical optimizationEstimation theoryApplied MathematicsGeneral EngineeringSystem identificationInverse problemDisplacement (vector)static testsconcentrated damageIdentification (information)Exact solutions in general relativityVariational principleApplied mathematicsimperfectionsCalculus of variationsSettore ICAR/08 - Scienza Delle CostruzioniHu-Washizu variational principlestructural parameter identificationMathematicsInternational Journal for Numerical Methods in Engineering
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Study of the thermo-mechanical performances of the IFMIF-EVEDA Lithium Test Loop target assembly

2012

Abstract Within the framework of the IFMIF R&D program and in close cooperation with ENEA-Brasimone, at the Department of Energy of the University of Palermo a research campaign has been launched to investigate the thermo-mechanical behavior of the target assembly under both steady state and start-up transient conditions. A theoretical approach based on the finite element method (FEM) has been followed and a well-known commercial code has been adopted. A realistic 3D FEM model of the target assembly has been set-up and optimized by running a mesh independency analysis. A proper set of loads and boundary conditions, mainly concerned with radiation heat transfer between the target assembly ex…

Steady stateMaterials scienceIFMIF Target assembly Thermo-mechanicsMechanical EngineeringNuclear engineeringLithium testFinite element methodLoop (topology)Hydrostatic testNuclear Energy and EngineeringHeat transferGeneral Materials ScienceTransient (oscillation)Boundary value problemSettore ING-IND/19 - Impianti NucleariCivil and Structural EngineeringFusion Engineering and Design
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